No setup required! Inch-compatible automatic lift-off device.
Process multiple sizes of wafers without changing setups! The multi-size compatible device achieves high productivity with minimal downtime for lift-off operations!
No need for setup changes due to different wafer sizes, leading to increased productivity! There is a strong demand for different inch sizes depending on the type of product, and a desire to handle larger wafer sizes in the future. Therefore, we offer a lift-off device that can process multiple sizes without the need for setup changes. 【Examples of compatible multiple sizes】 "2-3", "2-4", "3-4", "4-6", "6-8" inches 【Also compatible with thin wafers!】 We often hear concerns that high-pressure jets might break thin wafers (substrates). Our company has a proven track record of lift-off with GaAs wafers of 120um thickness (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Benefits of no setup changes for multiple wafer sizes】 ■ Reduced downtime and high operational efficiency ■ Prevents damage to equipment and devices due to adjustment errors after setup changes ■ Reduces processing recipe selection errors with automatic wafer size recognition ■ Burr removal ■ No reattachment of metal Please consider a demonstration first!
- Company：エイ・エス・エイ・ピイ
- Price：Other
